Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11459190 | Systems and methods for die transfer | Tsung-Sheng Kuo, Chih-Hung Huang, Chueng-Jen Wang, Hsuan Lee, Jiun-Rong Pai | 2022-10-04 |
| 11222802 | Multiple semiconductor die container load port | Chih-Hung Huang, Cheng-Lung Wu, Yu-Chen Chen, Yang-Ann Chu, Jiun-Rong Pai | 2022-01-11 |