TY

Tzu-Hsuan Yeh

TSMC: 1 patents #1,889 of 3,577Top 55%
Overall (2022): #222,777 of 548,613Top 45%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11244914 Bond pad with enhanced reliability Chern-Yow Hsu 2022-02-08