Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11374115 | Method for forming semiconductor device having boron-doped germanium tin epitaxy structure | Chung-En TSAI, Fang-Liang Lu, Chee-Wee Liu | 2022-06-28 |
PC
Pin-Shiang Chen
National Taiwan University: 1 patents #28 of 192Top 15%
Overall (2022): #299,812 of 548,613Top 55%
1
Patents 2022