Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482506 | Edge-trimming methods for wafer bonding and dicing | Feng-Chien Hsieh, Hsin-Chi Chen, Kuo-Cheng Lee, Yun-Wei Cheng | 2022-10-25 |
MC
Mu-Han Cheng
Overall (2022): #322,844 of 548,613Top 60%
1
Patents 2022