Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532579 | Passivation structure with increased thickness for metal pads | Ming Chyi Liu | 2022-12-20 |
| 11445104 | Device with a recessed gate electrode that has high thickness uniformity | Ming Chyi Liu, Tung-He Chou | 2022-09-13 |