HY

Hsiu-Mei Yu

VS Vanguard International Semiconductor: 1 patents #33 of 91Top 40%
📍 Baoshan, TW: #112 of 323 inventorsTop 35%
Overall (2022): #428,411 of 548,613Top 80%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11309201 Method of forming dice and structure of die Wei-Chan Chang, Chang-Sheng Lin, Chun-Yi Wu 2022-04-19