Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515239 | Quad flat no-lead package structure | Tai-Hung Lin, Jhih-Siou Cheng | 2022-11-29 |
| 11244891 | Integrated circuit package and die | Jhih-Siou Cheng, Chun-Wei Kang, Chun-Fu Lin, Ju-Lin Huang | 2022-02-08 |