Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532554 | Interconnect device and method | Ren-Fen Tsui, Jhon Jhy Liaw, Ying-Jhe Fu | 2022-12-20 |
| 11527540 | Implantations for forming source/drain regions of different transistors | Jhon Jhy Liaw, Ren-Fen Tsui | 2022-12-13 |
| 11251091 | Semiconductor device with contracted isolation feature | Ren-Fen Tsui, Jhon Jhy Liaw | 2022-02-15 |