Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11251127 | Interconnect structure with vias extending through multiple dielectric layers | Ming-Chung Liang, Chien-Chih Chiu, Chien-Han Chen | 2022-02-15 |
CH
Chun-Te Ho
Overall (2022): #500,505 of 548,613Top 95%
1
Patents 2022