Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443980 | Method of fabricating semiconductor device with metal pad extending into top metal layer | Chia-Chung Chen, Chi-Feng Huang, Victor Chiang Liang, Chung-Hao Chu | 2022-09-13 |