Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373925 | Silver-indium transient liquid phase method of bonding semiconductor device and heat-spreading mount and semiconductor structure having silver-indium transient liquid phase bonding joint | Yongjun Huo | 2022-06-28 |