Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387365 | Method of manufacturing a semiconductor device for recessed fin structure having rounded corners | Po-Chi Wu, Yueh-Chun Lai | 2022-07-12 |
CY
Cheng-Yen Yu
Overall (2022): #491,812 of 548,613Top 90%
1
Patents 2022