Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538938 | Method for forming stressor, semiconductor device having stressor, and method for forming the same | Hao-Hsiung Lin, Samuel C. Pan | 2022-12-27 |
CY
Che-Wei Yang
National Taiwan University: 1 patents #28 of 192Top 15%
Overall (2022): #492,141 of 548,613Top 90%
1
Patents 2022