Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456211 | Method of forming interconnect structure | Tung Ying Lee, Yu-Chao Lin | 2022-09-27 |
| 11450563 | Interconnect structure and method | Yu-Chao Lin, Tung Ying Lee | 2022-09-20 |
BL
Bo-Jiun Lin
Overall (2022): #174,798 of 548,613Top 35%
2
Patents 2022