Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11220396 | Package body and method of manufacturing package body | Hitoshi Tsuchida, Tadashi Omura, Toshitaka Nakagawa | 2022-01-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11220396 | Package body and method of manufacturing package body | Hitoshi Tsuchida, Tadashi Omura, Toshitaka Nakagawa | 2022-01-11 |