Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11505692 | (Meth) acrylic resin composition and electroconductive adhesive using the same | Soichi Ota, Yusuke KUWAHARA, Hitoshi Mafune, Tomoya Kodama, Masayuki Osada | 2022-11-22 |
| 11456581 | Routing structure of wire harness | Katsuya Hirakawa | 2022-09-27 |
| 11421133 | Thermosetting conductive adhesive | Soichi Ota, Hitoshi Mafune, Masayuki Osada | 2022-08-23 |
| 11359116 | Thermocurable electroconductive adhesive | Tomoya Kodama, Soichi Ota, Masayuki Osada, Hitoshi Mafune, Kanako Morii | 2022-06-14 |
| 11322332 | Apparatus and method for measuring energy spectrum of backscattered electrons | Sumio Sasaki, Yukihiro Tanaka, Yuichiro Yamazaki | 2022-05-03 |