Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456168 | Method of lapping semiconductor wafer and semiconductor wafer | Daisuke Hashimoto, Satoshi Matagawa | 2022-09-27 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456168 | Method of lapping semiconductor wafer and semiconductor wafer | Daisuke Hashimoto, Satoshi Matagawa | 2022-09-27 |