Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469194 | Method of manufacturing a redistribution layer, redistribution layer and integrated circuit including the redistribution layer | Paolo Colpani, Samuele Sciarrillo, Francesco Pipia, Simone Bossi, Carmela Cupeta | 2022-10-11 |