Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239158 | Wire bond inductor structures for flip chip dies | Paragkumar Ajaybhai Thadesar, Changhan Hobie Yun, Sameer S. Vadhavkar, Daniel Daeik Kim | 2022-02-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239158 | Wire bond inductor structures for flip chip dies | Paragkumar Ajaybhai Thadesar, Changhan Hobie Yun, Sameer S. Vadhavkar, Daniel Daeik Kim | 2022-02-01 |