Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289395 | Aperture structure on semiconductor component backside to alleviate delamination in stacked packaging | Junrong Yan, Xin Lu | 2022-03-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289395 | Aperture structure on semiconductor component backside to alleviate delamination in stacked packaging | Junrong Yan, Xin Lu | 2022-03-29 |