HM

Hirofumi Maruyama

TC Tamagawa Seiki Co.: 2 patents #1 of 8Top 15%
LC Lapis Semiconductor Co.: 1 patents #7 of 48Top 15%
Overall (2022): #154,867 of 548,613Top 30%
2
Patents 2022

Issued Patents 2022

Patent #TitleCo-InventorsDate
11253947 Magnet wire bonding method and bonding structure Hiroshi Kushihara, Kazuyuki Ishibashi, Shinichi Arai, Toshiki Muramatsu, Shinichi Hara +1 more 2022-02-22
11226792 Trigonometric function calculating device Masato Yamazaki 2022-01-18