Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11501981 | Methods for fabricating semiconductor packages by using a mold press with an upper chase and a lower chase | Kyung Beom SEO, Jong Kyu MOON, Jong Hyock PARK | 2022-11-15 |