Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11270923 | Semiconductor packages including a heat insulation wall | Jae Hyun Son, Ji Hyeok Shin | 2022-03-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11270923 | Semiconductor packages including a heat insulation wall | Jae Hyun Son, Ji Hyeok Shin | 2022-03-08 |