Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322475 | Stack semiconductor packages having wire-bonding connection structure | Jae-Hoon Lee | 2022-05-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322475 | Stack semiconductor packages having wire-bonding connection structure | Jae-Hoon Lee | 2022-05-03 |