Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373701 | Semiconductor device | Sang Hyun SUNG, Sung Lae OH | 2022-06-28 |
| 11282819 | Semiconductor device having chip-to-chip bonding structure | Sung Lae OH, Sang Hyun SUNG, Kwang Hwi Park | 2022-03-22 |