Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417618 | Semiconductor device including redistribution layer and method for fabricating the same | Seung Hwan Kim, Hyeong-Seok Choi, Shin Young Park | 2022-08-16 |
| 11398412 | Semiconductor package | — | 2022-07-26 |
| 11380595 | Semiconductor wafer, method for separating the semiconductor wafer, semiconductor chip, and semiconductor package including the semiconductor chip | — | 2022-07-05 |
| 11217544 | Semiconductor package including a semiconductor chip having a redistribution layer | Jong Hyun Kim, Seung Hwan Kim, Ki Young Kim | 2022-01-04 |