Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257801 | Stacked semiconductor package having mold vias and method for manufacturing the same | Sang Eun Lee, Hyung-Dong Lee | 2022-02-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257801 | Stacked semiconductor package having mold vias and method for manufacturing the same | Sang Eun Lee, Hyung-Dong Lee | 2022-02-22 |