Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488925 | Semiconductor package structure with heat sink and method preparing the same | Chengchung Lin, Mingchih Chen | 2022-11-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488925 | Semiconductor package structure with heat sink and method preparing the same | Chengchung Lin, Mingchih Chen | 2022-11-01 |