Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217508 | Lead structure of circuit with increased gaps between adjacent leads | Kuo-Wei Tseng, Jui-Hsuan Cheng | 2022-01-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217508 | Lead structure of circuit with increased gaps between adjacent leads | Kuo-Wei Tseng, Jui-Hsuan Cheng | 2022-01-04 |