Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11382214 | Electronic package, assemble substrate, and method for fabricating the assemble substrate | Lung-Yuan Wang | 2022-07-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11382214 | Electronic package, assemble substrate, and method for fabricating the assemble substrate | Lung-Yuan Wang | 2022-07-05 |