Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527472 | Electronic package, supporting structure and fabrication method thereof | Hao-Ju Fang, Ting-Wei Chi, Te-Fang Chu | 2022-12-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527472 | Electronic package, supporting structure and fabrication method thereof | Hao-Ju Fang, Ting-Wei Chi, Te-Fang Chu | 2022-12-13 |