JY

Jiaming Ye

S( Silergy Semiconductor Technology (Hangzhou): 1 patents #24 of 56Top 45%
Overall (2022): #402,066 of 548,613Top 75%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11232999 Chip package structure and method for forming chip package — 2022-01-25