Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508620 | Method of removing a substrate with a cleaving technique | Takeshi Kamikawa, Srinivas Gandrothula | 2022-11-22 |
HL
Hongjian Li
Overall (2022): #429,968 of 548,613Top 80%
1
Patents 2022