TI

Toru Ishizuka

SC Shin-Etsu Handotai Co.: 1 patents #3 of 31Top 10%
Overall (2022): #228,187 of 548,613Top 45%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11244852 Method for manufacturing bonded SOI wafer Setsuya Hama 2022-02-08