Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335664 | Integrated circuit packaging method and integrated packaging circuit | Chuan Hu, Junjun Liu, Edward R. Prack | 2022-05-17 |
| 11217542 | Three-dimensional module with integrated passive components | Guobiao ZHANG, Hongyu Yu, Shengming Zhou, Guoxing Zhang, Guangzhao Liu +2 more | 2022-01-04 |