Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11261305 | Thermosetting resin composition, prepreg, laminate, and printed circuit board | Qianfa Liu, Shanyin YAN, Xianping Zeng, Cuiming Du | 2022-03-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11261305 | Thermosetting resin composition, prepreg, laminate, and printed circuit board | Qianfa Liu, Shanyin YAN, Xianping Zeng, Cuiming Du | 2022-03-01 |