Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11536594 | Sensor component, pre-assembly arrangement for a sensor component, and method for producing a sensor component | Jürgen Rietsch, Andreas Plach, Stephan Bandermann, Andreas Albert, Klaus Scharrer +2 more | 2022-12-27 |
| 11245052 | Method of producing microelectronic components with a layer structure | Sven Albert, Rene Boettcher, Alexander Boehm, Mike Lindner | 2022-02-08 |