YM

Yusuke Masuda

DL Denka Company Limited: 1 patents #36 of 112Top 35%
📍 Osaka, JP: #65 of 110 inventorsTop 60%
Overall (2022): #192,284 of 548,613Top 40%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11292233 Laminated sheet and electronic component packaging container molded using same Ryosuke YANAKA 2022-04-05