Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404209 | Electrical device package structure and manufacturing method thereof | Ching-Hohn Len, Hong-Zong Xu, Hsing-Tsai Huang, Jie Zhu | 2022-08-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404209 | Electrical device package structure and manufacturing method thereof | Ching-Hohn Len, Hong-Zong Xu, Hsing-Tsai Huang, Jie Zhu | 2022-08-02 |