Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11284509 | Method for forming flexible substrate including via, and flexible substrate having via | Yongtaek Hong, Eunho Oh, Byeongmoon Lee | 2022-03-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11284509 | Method for forming flexible substrate including via, and flexible substrate having via | Yongtaek Hong, Eunho Oh, Byeongmoon Lee | 2022-03-22 |