Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508850 | Manufacturing method of semiconductor device | Shunpei Yamazaki, Naoki OKUNO, Tetsuya Kakehata, Yuji Egi | 2022-11-22 |
| 11257959 | Semiconductor device and method for manufacturing the semiconductor device | Shunpei Yamazaki, Tsutomu Murakawa, Katsuaki TOCHIBAYASHI, Kentaro SUGAYA | 2022-02-22 |
| 11214041 | Oxygen-absorbing packaging material | Takafumi Ohsawa, Yoshihiro Ohta | 2022-01-04 |