Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11421107 | Curable resin composition, cured product, adhesive, bonding film, coverlay film, flexible copper-clad laminate and circuit board | Sayaka Wakioka, Kohei Takeda, Yuta Oatari, Masami Shindo | 2022-08-23 |