Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515317 | Three-dimensional memory device including through-memory-level via structures and methods of making the same | Takaaki Iwai, Junpei Kanazawa, Hisakazu Otoi, Raiden Matsuno | 2022-11-29 |