Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11331765 | Methods of lapping a substrate while heating at least a portion of the substrate, and related substrates and systems | Andrew Sherve, Neil Zuckerman, Andrew David Habermas | 2022-05-17 |
| 11217273 | Heat sinking layer between a substrate and encasing layers of a recording head | Helene Parwana Habibi, Raul Horatio Andruet, Neil Zuckerman, Frank A. McGinnity, Giovanni A. Badini Confalioneri +3 more | 2022-01-04 |