Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417621 | Memory die with source side of three-dimensional memory array bonded to logic die and methods of making the same | Naohiro Hosoda, Masanori Tsutsumi | 2022-08-16 |
| RE49165 | On-pitch drain select level isolation structure for three-dimensional memory device and method of making the same | Yanli Zhang, Masanori Tsutsumi, Shinsuke Yada, Johann Alsmeier | 2022-08-09 |