Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444101 | Spacerless source contact layer replacement process and three-dimensional memory device formed by the process | Jo SATO, Tatsuya Hinoue | 2022-09-13 |
| 11367733 | Memory die with source side of three-dimensional memory array bonded to logic die and methods of making the same | Naohiro Hosoda, Masanori Tsutsumi | 2022-06-21 |