Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502061 | Semiconductor package | Youngsang Cho, Heeseok Lee, Moonseob Jeong | 2022-11-15 |
| 11373933 | Semiconductor package including composite molding structure | Heeseok Lee | 2022-06-28 |
| 11251102 | Semiconductor module including heat dissipation layer | Youngsang Cho | 2022-02-15 |