Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488906 | Bridge embedded interposer, and package substrate and semiconductor package comprising the same | Jung-Hyun Cho, Young Kwan Lee, Young Sik Hur, Ho Kwon Yoon | 2022-11-01 |
| 11417631 | Semiconductor package | Hyung Joon Kim, Han Kim | 2022-08-16 |