Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11439020 | Electronic component-embedded substrate | Yong Hoon Kim | 2022-09-06 |
| 11315879 | Package substrate and multi-chip package including the same | Tae-Seong Kim | 2022-04-26 |
| 11259404 | Rigid-flexible printed circuit board and electronic component module | Jun Oh Hwang, Jae Ho Shin | 2022-02-22 |