Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355445 | Semiconductor packages | Joonsung Kim, Doohwan Lee, Bongsoo Kim, Seokbong Park | 2022-06-07 |
| 11355467 | Semiconductor devices including thick pad | Daehee Lee, Hyunchul Jung | 2022-06-07 |